Semiconductor/LCD

APS Materials understands that the manufacturing processes of silicon wafers and semiconductors require very specialized, highly-engineered thermal coatings because of the harsh environment required for the operation. Because of this understanding, the leading members of the semiconductor manufacturing industry trust APS to produce reliable coatings for their semiconductors.

View detailed semiconductor coating applications

APS' Technical Capabilities

• Laboratory Coating Image Analysis
• Corrosion Testing
• Tensile Strength Testing
• Final Cleaning and packaging
• Research and Development
• Engineering Support Materials

Materials

The virtually limitless range of materials available to the thermal spray process enables us to combine many unusual compounds and to produce devices with interesting properties. APS has successfully applied the following materials:

• Aluminum/Aluminum Oxide
• Alumina-Titania
• Boron/Boron Carbide
• Copper
• Hafnium
• Magnesium Oxide
• Molybdenum
• Niobium
• Silicon/Silicon Carbide
• Tantalum
• Titanium/Titanium Diboride
• Tungsten/Tungsten Carbide
• Yittria-Aluminum Garnet
• Yittrium Oxide
• Yittria/Yittria Stabilized Zirconia
• Zirconium Diboride

Facilities

We are committed to providing our customers with quality controlled, precision semiconductor coatings that yield specific, repeatable performance characteristics with complete contamination control.

• 100% robotic coating application
• On-site Metallographic Laboratory
• Process dedicated spray rooms
  • HEPA filtered makeup air
  • Climate controlled
  • Isolated
  • Class 10,000 clean room