Semiconductor Manufacturing

The manufacturing processes of silicon wafers and semiconductors require very specialized, highly- engineered coatings solutions because of the harsh environment required for the operation. This harsh environment dramatically shortens the life of chamber components, used to house the process, threatening the quality of the highly sensitive products.

Technical Capabilities

  • Laboratory Coating Image Analysis
  • Corrosion Testing
  • Tensile Strength Testing
  • Final Cleaning and packaging
  • Research and Development
  • Engineering Support Materials

Materials
The virtually limitless range of materials available to the thermal spray process enables us to combine many unusual compounds and to produce devices with interesting properties. APS has successfully applied the following materials:

  • Aluminum/Aluminum Oxide
  • Alumina-Titania
  • Boron/Boron Carbide
  • Copper
  • Hafnium
  • Magnesium Oxide
  • Molybdenum
  • Niobium
  • Silicon/Silicon Carbide

  • Tantalum/Tantalum Disiliate
  • Titanium/Titanium Diboride
  • Tungsten/ Tungsten Carbide
  • Yittria-Aluminum Garnet
  • Yittrium Oxide
  • Yittria/Yittria Stabilized Zirconia
  • Zirconium Diboride
 


Facilities

We are committed to providing our customers with quality controlled, precision coatings that yield specific, repeatable performance characteristics with complete contamination control.

  • 100% robotic coating application
  • On-site Metallographic Laboratory
  • Process dedicated spray rooms
    • HEPA filtered makeup air
    • Climate controlled
    • Isolated
    • Class 10,000 clean room

Click the 'applications' link above for detailed description.

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